Plaskon NXG-1HS

This material is an epoxy molding compound for high temperature, lead-free reflow in heat spreader applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

基本信息
特性	半导电 低（至无）铅含量 低吸湿性 快速固化 良好的成型性能 耐热性，高 无卤
形式	液体
加工方法	树脂传递成型

物理性能	额定值	单位制	测试方法
比重		g/cm³	ASTM D792

机械性能	额定值	单位制	测试方法
弯曲模量			ASTM D790
22°C		MPa	ASTM D790
260°C		MPa	ASTM D790
弯曲强度			ASTM D790
22°C		MPa	ASTM D790
260°C		MPa	ASTM D790

热性能	额定值	单位制	测试方法
玻璃转化温度		°C	ASTM E1356
线形热膨胀系数 - 流动		cm/cm/°C	ASTM D696
导热系数		W/m/K	ASTM C177

可燃性	额定值		测试方法
UL 阻燃等级 (3.18 mm)			UL 94

补充信息

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 132 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.28%Cull Hot Hardness, Shore D: 80All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 8.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 33 cm^-6/cm/°C

注射说明
Resin Transfer Molding: Molding Temperature: 165 to 185°C Molding Pressure: 1000 psi In Mold Cure Time: 50 to 100 sec Post Mold Cure Time, 175°C: 0 to 2 hr