Boda BDF275P

BDF275P is a low viscosity curative incorporated fluoroelastomer copolymer.

This grade is well suited for application where good flowability and excellent mold release property are required. BDF275P can be compounded to meet the major fluoroelastomer specifications.

BDF275P can be used for injection molding of O-rings and gaskets, or extrusion of complicated geometries. It can be mixed using typical fluoroelastomer compounding ingredients. Mixing can be accomplished with two-roll mills or internal mixers. Finished goods can be produced by a variety of rubber processing methods.

基本信息
特性	低粘度 共聚物 良好的流动性 脱模性能良好
用途	垫圈 复合
外观	白色
加工方法	复合 挤出 注射成型

物理性能	额定值	单位制	测试方法
比重		g/cm³
门尼粘度 (ML 1+10, 121°C)		MU
氟含量		%
可溶性

弹性体	额定值	单位制	测试方法
MH 1(177°C)		N·m
ML 2(177°C)		N·m
t'90 3(177°C)		min
ts2 4(177°C)		sec

硬度	额定值	单位制	测试方法
肖氏硬度 5(邵氏 A)			ASTM D2240

弹性体	额定值	单位制	测试方法
抗张强度 6(屈服)		MPa	ASTM D412
伸长率 7(断裂)		%	ASTM D412
压缩永久变形 (200°C, 70 hr)		%	ASTM D395B

补充信息
Test Compound: Polymer: 100 MT Black (N990): 30 phr MgO: 3 phr Ca(OH)2: 6 phr Curing Condition: Press: 10 min at 170°C Oven: 24 hr at 230°C

备注
1 .	MDR2000 Rheometer, 100cpm, 0.5° Arc, 6 minutes
2 .	MDR2000 Rheometer, 100cpm, 0.5° Arc, 6 minutes
3 .	MDR2000 Rheometer, 100cpm, 0.5° Arc, 6 minutes
4 .	MDR2000 Rheometer, 100cpm, 0.5° Arc, 6 minutes
5 .	Press Time: 10 min, Press Temperature: 170°C, Post Cure Time: 24 hr, Post Cure Temperature: 230°C
6 .	Press Time: 10 min, Press Temperature: 170°C, Post Cure Time: 24 hr, Post Cure Temperature: 230°C
7 .	Press Time: 10 min, Press Temperature: 170°C, Post Cure Time: 24 hr, Post Cure Temperature: 230°C