This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 125 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 14 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C
Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C
Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C
注射说明
Resin Transfer Molding:
Preheat Temperature: 80 to 85°C
Molding Temperature: 165 to 170°C
Molding Pressure: 500 to 900 psi
In Mold Cure Time: 100 to 200 sec
Transfer Time: 6 to 15sec