Plaskon CMU-870-2B

环氧; 环氧树脂

Cookson Electronics - Semiconductor Products

产品说明:

This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? CMU Series is the total molded underfill solution for Flip Chip in Package.
Plaskon CMU-870-2B 物性表
基本信息
特性
  • 半导电
  • 低翘曲性
  • 可加工性,良好
形式
  • 液体
加工方法
  • 树脂传递成型
物理性能额定值单位制测试方法
比重 g/cm³ASTM D792
收缩率 - 流动 %ASTM D955
机械性能额定值单位制测试方法
弯曲模量 ASTM D790
    22°C MPaASTM D790
    215°C MPaASTM D790
弯曲强度 ASTM D790
    22°C MPaASTM D790
    215°C MPaASTM D790
热性能额定值单位制测试方法
玻璃转化温度 °CASTM E1356
线形热膨胀系数 - 流动 cm/cm/°CASTM D696
导热系数 W/m/KASTM C177
电气性能额定值单位制测试方法
体积电阻率 ohms·cmASTM D257
介电强度 kV/mmASTM D149
介电常数 (1 kHz)ASTM D150
耗散因数 (1 kHz)ASTM D150
可燃性额定值单位制测试方法
UL 阻燃等级 (3.18 mm)UL 94
补充信息
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 125 cmShimadzu Viscosity, 175°C, 1000 psi: 50 poiseRam Follower Gel Time, 175°C, 1000 psi: 14 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C
注射说明
Resin Transfer Molding: Preheat Temperature: 80 to 85°C Molding Temperature: 165 to 170°C Molding Pressure: 500 to 900 psi In Mold Cure Time: 100 to 200 sec Transfer Time: 6 to 15sec
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